The laser cutting machine generally consists of a laser head, a mobile positioning system and software. The mobile positioning system drives the worktable or the laser head to move the material to be cut under the system drive head. The laser head is composed of a light source part and a cutting head. The light source part generates a focused laser beam with a short wavelength, and the laser beam passes through the cutting head and is vertical. Focusing on the surface of the material being cut, heating, melting, evaporating the material being cut to form a slit, and the closed slit forms a pad opening. The software section is used for data reception, processing and control and driving of laser heads and mobile systems.
Compared with the etching method and the electroforming method, the laser method for producing a printed solder paste template has the following characteristics:
(1) High precision, position accuracy and dimensional accuracy of the leak holes on the stencil are guaranteed. The accuracy of the laser machine itself is very high, the X and Y axial precision can reach ±3μm (the domestic photoplotter has a clearness of up to 15μm); the repeatability is up to ±1μm, and because the data is collected from the computer design file, the computer is directly driven, It reduces the possibility of deviations in processes such as stenciling and graphics transfer, especially the advantages of the large-sized circuit board;
(2) The processing cycle is short, and 8,000 pieces of pad can be cut per hour, and the number of round holes can be up to 25,000. The data processing and processing can be completed in one go, and the template can be obtained. Thanks to the direct processing of data-driven equipment, the process between design and manufacturing is reduced, and the market can react quickly;
(3) Computer control, good quality consistency, and control quality without relying on complex chemical formulas and process parameters. The stencil production base has no waste. At the same time, the laser stencil printing has a low defect rate, which is suitable for large-volume, automated SMT production requirements;
(4) The hole wall is smooth, the roughness is less than 3μm, and the beam focusing characteristic can make the opening small and large, and has a certain taper to facilitate the release of the solder paste, and the volume and shape of the solder paste can be controlled;
(5) No chemical liquid, no chemical treatment, no environmental pollution;
(6) Finer, with a resolution of 0.625μm and a beam diameter of 40μm, it is possible to make a pad of less than 100μm wide and a hole of 50μm diameter to meet fine pitch requirements. (end)
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Tag: Cutting material Laser cutting machine Laser head Processing Repeatability
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