Failure analysis is an emerging discipline that has been developing and has spread from military industry to ordinary enterprises in recent years. It is generally based on the failure mode and phenomenon, through analysis and verification, to simulate the phenomenon of recurring failure, find out the cause of failure, and dig out the mechanism of failure activities. It has strong practical significance in improving product quality, technology development, improvement, product repair and arbitration failure accidents. The methods are divided into destructive analysis, non-destructive analysis, physical analysis, chemical analysis, etc.
In 2018, the failure analysis technology sharing event, Yizhun Technology has been supported and encouraged by peers in the semiconductor industry since its establishment in Beijing in 2012. In the past 6 years, there have been praises, praises, stumbling blocks, and shortcomings; thank you The long-term tolerance and support, and the feedback and opinions between our peers are the biggest driving forces for our progress.
We have also been striving to absorb fresh knowledge in the semiconductor industry, keep up with the industry trends, improve the company's equipment and technical requirements, and do our best to reach the experimental standards.
On the occasion of the Dragon Boat Festival, Yizhun Technology hereby launches a special event in mid-2018 to give back to the support of new and old customers for us.
Item 1 Probe station test free
Item 2 OM
Item 3 Decap
Item 4 EMMI
Item 5 IV curve test
The activities launched by Yizhun Technology have a large profit margin and a wide range of coverage. You can take the actual experience of the sample to see the effect.
Failure analysis technology sharing activities and details
Attached project introduction
Instrument Probe Probe Station
Probe probe station is mainly used in the testing of semiconductor industry and optoelectronic industry. It is widely used in the research and development of precision electrical measurement of complex, high-speed devices, aimed at ensuring quality and reliability, and reducing the cost of research and development and device manufacturing processes.
Application range:
1. Use the needle (soft needle, hard needle, pico probe needle) to test the signal of the chip pad, and perform electrical measurement on the cross pad drawn by the FIB.
2. Liquid crystal method-leakage analysis, using liquid crystal to sense the leakage of the IC and arrange the molecular arrangement, showing a spot-like image under the microscope, which is different from other areas.
Look for the leakage areas (fault points exceeding 10mA) that trouble designers in practical analysis.
Laser Decap laser capping machine is also called laser unsealing machine and laser capping machine. Laser unsealing machine introduction: laser unsealing machine is used to unseal components, that is, to use laser unsealing machine to remove the plastic sealing material of components, copper in the past two years There are more line products, and customers have higher and higher requirements for unsealing. As a result, the demand for laser unsealing machines has emerged. Its characteristics of safety, convenience, and high reliability are very popular among customers.
Laser unsealing machine features:
1. Good opening effect for copper lead packaging 2. Very convenient to open complex samples 3. Repeatability and high consistency 4. Computer-controlled opening shape, position, size, time, etc., convenient operation 5. Right Environmental and human pollution damage is small, high safety6, almost no consumables, low cost of use7, small size, easy to place.
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