**Chip Push-Pull Tester – Superior to Dage4000 in Performance**
The Chip Push-Pull Tester, also known as the IC Weld Strength Tester, is a high-precision instrument designed for evaluating the mechanical strength of microelectronic components. It supports both pull and shear testing, making it an essential tool for semiconductor packaging, LED manufacturing, optoelectronics, and PCBA assembly. This multi-functional push-pull testing machine uses AUTO-RANGE technology and VPM vertical positioning to ensure accurate and repeatable results. With a resolution as fine as 0.0001g, it delivers exceptional precision for critical applications.
This advanced push-pull testing system is ideal for wire bond strength evaluation, chip shear testing, and other specialized tests such as ball shear, cold bump pull, and stud pull. It is widely used in industries including automotive electronics, aerospace, and military sectors, where reliability and performance are paramount. The device’s robust design, high accuracy, and user-friendly interface make it a top choice for research institutions, failure analysis labs, and educational facilities.
Key features include:
- **Weight:** 65 kg
- **Dimensions:** 620 mm (W) × 520 mm (L) × 700 mm (H)
- **X/Y Axis Travel:** 60 mm with 0.25 µm resolution and 2.5 mm/s speed
- **Z Axis Travel:** 70 mm with 1 µm resolution and 10 mm/s speed
- **Load Capacity:** Up to 200 kg (X/Y), 100 kg (Z)
- **Measurement Range:** 100 g – 100 kg
- **Accuracy:** ±0.1%
The system supports a wide range of test methods, including gold and aluminum wire tension, solder joint shear, wafer bonding, BGA ball testing, and more. Its modular design allows users to customize the setup based on specific testing needs. Additionally, powerful software provides detailed data analysis, statistical reports, and quality control insights.
The push-pull tester is not only suitable for destructive testing but also offers non-destructive options, ensuring component integrity during evaluation. It can perform tasks like pin fatigue testing, bending and compression tests, and 3D height mapping. Whether you're working on semiconductor packages, SMT assemblies, or optoelectronic devices, this system meets the highest industry standards.
**Recommended Testing Modules:**
1. **Gold Wire Tension Test Module (100g):** Ideal for testing gold wires under 100g force. Features a 50µm hook with a 125µm needle length.
2. **Gold Ball Thrust Test Module (250g):** Designed for gold ball testing up to 250g force. Includes a 150µm blade width and 1.55mm diameter push tip.
For pipe fillet weld testing after placement, the system supports tensile modules up to 10kg and thrust modules up to 100kg.
The device has been successfully deployed in several leading testing centers, including Weifang Semiconductor Lighting Product Testing Center and Changzhou Semiconductor Lighting Application Technology Research Institute. It also offers 24/7 support, custom sample solutions, and compatibility with other brands like Dage4000.
Whether you're looking for a reliable solution for wire bond testing, chip shear analysis, or component strength evaluation, this push-pull tester delivers outstanding performance and flexibility. For more information or to schedule a demo, contact CK at 15989565652. Watch the Gold Pull Test Video here: [https://www.youtube.com/watch?v=6NpddQv-mYI](https://www.youtube.com/watch?v=6NpddQv-mYI)
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