**Chip Push-Pull Tester – Superior Performance for IC Weld Strength and Wire Bond Testing**
The Chip Push-Pull Tester is a high-precision instrument designed for evaluating the mechanical strength of microelectronic components, including wire bonds, chip shear, and solder joints. It outperforms industry standards like the Dage 4000 with its advanced AUTO-RANGE technology and VPM vertical positioning system. The device features a resolution as fine as 0.0001g, ensuring exceptional accuracy in every test.
This multi-functional push-pull testing machine is widely used in semiconductor packaging, PCBA manufacturing, and failure analysis. It supports a broad range of applications such as wire pull, ball shear, cold bump pull, and more. The tester is ideal for semiconductor IC packages, LED assemblies, optoelectronics, automotive electronics, aerospace, and military industries. Its versatility makes it a valuable tool in research institutions, laboratories, and educational facilities.
With a weight of 65 kg and a compact design (620mm x 520mm x 700mm), the machine offers precise control over X, Y, and Z axes. The X and Y travel is up to 60 mm with a resolution of 0.25 micrometers, while the Z-axis provides 70 mm travel at 1 micron resolution. The system can handle loads up to 200 kg on X/Y and 100 kg on Z, making it suitable for demanding testing scenarios.
The measurement range spans from 100g to 100kg, with an accuracy of 0.1%. It supports multiple test modes, including tensile, shear, compression, and peel tests. The device also includes powerful software for data analysis, statistical reporting, and quality control.
Key functions include:
- Multi-functional push-pull testing
- Customizable modules for various applications
- High-speed and high-resolution measurements
- User-friendly interface and automated testing
Applications cover gold and aluminum wire bonding, chip shear, BGA ball shear, PCB component shear, and more. The machine is also capable of performing non-destructive tests, fatigue tests, and 3D height mapping.
Notable clients include Weifang Semiconductor Lighting Product Testing Center, Changzhou Semiconductor Lighting Application Technology Research Institute, and several other leading companies. The device is supported by 24/7 service, custom sample solutions, and compatibility with Dage 4000 accessories.
**Recommended Test Modules:**
1. **Gold Wire Tension Test Module (100g force):** Ideal for testing gold wires under 100g. Includes a tension hook with a diameter of 50 microns and a needle length of 125 microns.
2. **Gold Ball Thrust Test Module (250g force):** Suitable for gold ball tests up to 250g. Features a thrust blade with a width of 150 microns and a diameter of 1.55 mm.
3. **Pipe Fillet Weld Tension Module (10kg force):** Designed for post-placement weld testing. Supports up to 10kg tension.
4. **Thrust Module (100kg force):** For high-load thrust testing, suitable for up to 100kg.
For more information or to view a video demonstration of the gold pull test, visit [this link](/programs/view/6NpddQv-mYI/). Contact CK at 15989565652 for assistance.
Ningbo Safewell Plumbing Co., Ltd. , https://www.safewellbrass.com